Semiconductor package and method for manufacturing the same

Details Semiconductor package and method for manufacturing the same Semiconductor package and method for manufacturing the same

2011-03-08

2011-03-08

Lee, Hsien-ming (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S684000, C257S687000, C257SE21499, C257SE21513, C257SE23116, C438S106000, C438S107000, C438S110000

Reexamination Certificate

active

07902650

ABSTRACT:
A semiconductor package includes a carrier, a chip, a stiffener and an encapsulant. The chip is disposed on the carrier. The stiffener is disposed around the chip, directly contacts the carrier, and is mounted on the carrier. The encapsulant is adapted to seal the chip and the stiffener.

REFERENCES:
patent: 6284569 (2001-09-01), Sheppard et al.
patent: 6894229 (2005-05-01), Cheah
patent: 7005737 (2006-02-01), Zhao et al.

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