Semiconductor package and method for making the same

Details Semiconductor package and method for making the same Semiconductor package and method for making the same

2006-08-01

2006-08-01

Smith, Zandra V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S780000, C257S784000, C257S786000

Reexamination Certificate

active

07084499

ABSTRACT:
A method for making a semiconductor package includes preparing a die with bonding pads, forming conductive bodies on the die such that each conductive body is electrically connected to a respective bonding pad and has a trace part offset from the respective bonding pad, forming an encapsulant on each bonding pad, forming a protective layer on the die and the encapsulant, and forming conductive bumps such that each bump is electrically connected to the trace part of a respective conductive body and protrudes outwardly from the protective layer.

REFERENCES:
patent: 5933169 (1999-08-01), Sugahara
patent: 6426545 (2002-07-01), Eichelberger et al.
patent: 6660626 (2003-12-01), Lin
patent: 6701614 (2004-03-01), Ding et al.
patent: 6891248 (2005-05-01), Akram et al.
patent: 2003/0201534 (2003-10-01), Eichelberger et al.

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