Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2011-04-26
2011-04-26
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C438S127000
Reexamination Certificate
active
07932617
ABSTRACT:
A semiconductor package, a manufacturing method thereof and an encapsulating method thereof are provided. The semiconductor package includes a substrate, a flip chip, a plurality of conductive parts and a sealant. The substrate has a substrate upper surface. The flip chip has an active surface and a chip surface opposite to the active surface. The conductive parts electrically connect the substrate upper surface and the active surface. The sealant envelops the flip chip, and the space between the substrate upper surface and the active surface is filled with a portion of the sealant. The sealant further has a top surface. wherein, the chip surface is spaced apart from the top surface by a first distance, the substrate upper surface is spaced apart from the active surface by a second distance, and the ratio of the first distance to the second distance ranges from 2 to 5.
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patent: 6750080 (2004-06-01), Masuda et al.
patent: 6921967 (2005-07-01), Tzu et al.
patent: 7230331 (2007-06-01), Chen et al.
patent: 2003/0011078 (2003-01-01), Fukao et al.
Kao Chung-Yao
Ou Tsang-Hung
Advanced Semiconductor Engineering Inc.
Clark S. V
Muncy Geissler Olds & Lowe, PLLC
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