Semiconductor package and manufacturing method thereof

Details Semiconductor package and manufacturing method thereof Semiconductor package and manufacturing method thereof

2006-07-18

2006-07-18

Tran, Thien F. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S693000, C257S696000

Reexamination Certificate

active

07078798

ABSTRACT:
A manufacturing method of a semiconductor package includes the following steps of: Providing a lead frame including a plurality of leads, each of the leads having an outer lead portion, an inner lead portion and a terminal. Forming a first insulation layer on the inner lead portions and terminals. Forming a die pad on the first insulation layer. Attaching a semiconductor die to the die pad. Forming a plurality of wires for bonding pads of the semiconductor die to corresponding outer lead portions. Finally, forming a molding compound for encapsulating the lead frame, first insulation layer, die pad, semiconductor die, and wires. Furthermore, this invention also discloses a semiconductor device manufactured by utilizing the method.

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patent: 6740541 (2004-05-01), Rajeev

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