Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Patent
1997-03-10
1998-07-21
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With large area flexible electrodes in press contact with...
257694, 257787, 257698, 257666, H01L 2548
Patent
active
057838615
ABSTRACT:
A semiconductor package comprises at least one semiconductor chip; a lead frame having a chip paddle supporting a semiconductor chip, a plurality of inner leads wire-bonded to the chip and a plurality of outer lead extended from the inner leads; and a plastic molding compound sealing the chip and the inner lead of the lead frame, wherein the outer leads of the lead frame being arranged within an area of a bottom surface of the plastic molding compound.
A lead frame for use in the semiconductor package comprises a plurality of inner leads to be connected respectively to pads of a semiconductor chip; a plurality of outer leads extended from the inner lead and to be connected to other circuit, and the outer leads being bent to downward from an internal end of the inner lead.
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Abstract and Figs. 1-3 of U.S. Pat. No. 5,357,139 issued Oct. 18, 1994 to Yaguchi et al, titled "Plastic Encapsulated Semiconductor Device And Lead Frame".
Abstract of Japanese Patent 61-299537 issued Jun. 23, 1988 to Hitoshi Ito, titled "Resin Packaged Type Semiconductor Device".
Abstract of Japanese Patent 60-141178 issued Aug. 1, 1987 to KO ASO, titled "Resin-Sealed Type Semiconductor Device".
Clark S. V.
LG Semicon Co. Ltd.
Saadat Mahshid D.
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