Semiconductor package and its manufacturing method

Details Semiconductor package and its manufacturing method Semiconductor package and its manufacturing method

2007-04-10

2007-04-10

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000

Reexamination Certificate

active

10921642

ABSTRACT:
A semiconductor package comprising paddle and a plurality of leads which extend at least partially about the die paddle in spaced relation thereto. Attached to the die paddle is a semiconductor die which is electrically connected to at least some of the leads. Attached to the semiconductor die is at least one inner package. A package body encapsulates the die paddle, the leads, the semiconductor die and the inner package such that a portion of each of the leads and a portion of the inner package are exposed in the package body.

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