Semiconductor package and fabrication method thereof

Details Semiconductor package and fabrication method thereof Semiconductor package and fabrication method thereof

2006-11-01

2009-02-10

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S784000, C257SE23061

Reexamination Certificate

active

07489044

ABSTRACT:
The present invention provides a semiconductor package and a fabrication method thereof. The method includes the steps of: providing a chip carrier module having a plurality of chip carriers, disposing a plurality of electrical connecting points on the chip carriers, performing chip mounting and molding on the chip carrier module to form an encapsulant encapsulating the semiconductor chip, exposing the electrical connecting points from the encapsulant; forming a patterned circuit layer on the encapsulant, electrically connecting the patterned circuit layer to the electrical connecting points, cutting and separating the chip carriers to form a plurality of semiconductor packages each having a circuit layer formed on the encapsulant such that the circuit layer provides extra electrical connecting points and thereby enhances electrical performance of electrical products. During a package stacking process, no package is limited by the design of another package below.

REFERENCES:
patent: 6043109 (2000-03-01), Yang et al.
patent: 6483184 (2002-11-01), Murata
patent: 6552426 (2003-04-01), Ishio et al.
patent: 6723585 (2004-04-01), Tu et al.
patent: 6815254 (2004-11-01), Mistry et al.
patent: 7227243 (2007-06-01), Shizuno
patent: 7315077 (2008-01-01), Choi et al.

Affiliated with

Also associated with

Rating

Semiconductor package and fabrication method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package and fabrication method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package and fabrication method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4098500