Semiconductor package and fabricating method thereof

Details Semiconductor package and fabricating method thereof Semiconductor package and fabricating method thereof

2007-04-13

2010-10-05

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S780000, C438S598000

Reexamination Certificate

active

07808105

ABSTRACT:
A semiconductor package includes a first semiconductor die; a first redistribution layer coupled to a bonding pad of the first semiconductor die; a first solder bump coupled to the first redistribution layer; a second semiconductor die; a second redistribution layer coupled to a bonding pad of the second semiconductor die; a second solder bump coupled to the second redistribution layer and to the first solder bump; a third redistribution layer coupled to the second redistribution layer; and a solder ball coupled to the third redistribution layer.

REFERENCES:
patent: 6607938 (2003-08-01), Kwon et al.
patent: 7208825 (2007-04-01), Pu et al.
patent: 7285864 (2007-10-01), Takyu et al.
patent: 7368374 (2008-05-01), Chia et al.
patent: 2002/0074637 (2002-06-01), McFarland

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