Semiconductor package and electronic array having improved heat

Details Semiconductor package and electronic array having improved heat Semiconductor package and electronic array having improved heat

1979-04-06

1981-09-29

James, Andrew J.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 80, 357 74, 165 80B, H01L 3902, H01L 2302, H01L 2312

Patent

active

042926475

ABSTRACT:
A semiconductor package and electronic array in which the semiconductor packages of the array share a common substrate. The substrate has a plurality of sets of contacts with each set of contacts receiving contacts of a semiconductor chip. Each chip and set of contacts is surrounded by a closed length of bond receptive material. A heat dissipation member is attached to each chip by means of a heat conductive plate, and an annular ring is bonded to each heat dissipation member and to the closed length of bond receptive material to hermetically seal the chip.

REFERENCES:
patent: 3365620 (1968-01-01), Butler et al.
patent: 3406753 (1968-10-01), Habdas
patent: 3590915 (1971-07-01), Riedel
patent: 4069498 (1978-01-01), Joshi
patent: 4092697 (1978-05-01), Spaight
Chip Heat Sink Package; Johnson IBM Technical Bulletin vol. 12, No. 10, Mar. 1970, p. 1665.
Cooling Cap for Powder or Liquid Filled Module; Antipps; IBM Technical Bulletin, vol. 18, No. 5, Oct. 1975, pp. 1387 & 1388.
Centerless Ceramic Package with Directly Connected Heat Sink, IBM Bulletin; Ronkese, vol. 20, No. 19, Feb. 1978.
Semiconductor Package with Improved Cooling, IBM Tech. Bulletin, vol. 20, No. 9, Feb. 1978 pp. 3452 & 3453.

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