Semiconductor package and device having heads coupled with insul

Details Semiconductor package and device having heads coupled with insul Semiconductor package and device having heads coupled with insul

1997-05-19

1998-12-08

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257737, 257734, 257778, 257692, 257773, 257787, 257784, H01L 2300, H01L 2328, H01L 2348

Patent

active

058474587

ABSTRACT:
A semiconductor device package includes a plurality of leads and a stage, for mounting a semiconductor chip, arranged in juxtaposition at predetermined spatial intervals. A protruding terminal is formed at a predetermined portion on the lower surface of each of the leads. An insulating material is deposited in a continuous layer on the upper surfaces and the side surfaces of a plurality of the leads and on the side surfaces of the stage. A plurality of the leads and the stage are integrally coupled to each other through the insulating material and, therefore, the upper surfaces of the leads, the upper surface of the stage for bonding a semiconductor chip, and the terminals on the lower surfaces of the leads are exposed outside the insulating material. A semiconductor chip is bonded on the upper surface of the stage, the electrodes of the chip are electrically connected to the terminals on the upper surfaces of the leads, and the upper surface of the stage and the upper surfaces of the leads are deposited with a sealing insulating material thereby to seal the semiconductor chip in the sealing material.

REFERENCES:
patent: 4697943 (1987-10-01), Ookubo
patent: 5463593 (1995-10-01), Mostafazadeh et al.
patent: 5471088 (1995-11-01), Song
patent: 5497032 (1996-03-01), Tsuji et al.
patent: 5656550 (1997-08-01), Tsuji et al.

Affiliated with

Also associated with

Rating

Semiconductor package and device having heads coupled with insul does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package and device having heads coupled with insul, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package and device having heads coupled with insul will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-180877