Semiconductor package and computer using the package

Details Semiconductor package and computer using the package Semiconductor package and computer using the package

1989-09-28

1992-03-10

LaRoche, Eugene R.

357 81, H01L 2302

Patent

active

050953591

ABSTRACT:
A semiconductor package for use in computers includes a insulating substrate onto which a semiconductor device is mounted, an insulating cap which shuts out outside air and seals said semiconductor device, power-source lines which provide power to the semiconductor device, and signal lines which transmit output signals from the semiconductor device to external circuits. The signal lines are arranged perpendicularly to the insulating substrate so that they are prevented from the dielectric constant of the insulating substrate, while the power-source lines are formed within the insulating substrate and connected through conductive layers parallel to the surface onto which the semiconductor is mounted to external leads.

REFERENCES:
patent: 4744007 (1988-05-01), Watari
patent: 4894708 (1990-01-01), Watari
"Components and Packing for the FACOM M-780" Fujitsu 37.2 pp. 116-123.

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