Semiconductor package and amplifier employing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Patent

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Details

257701, 257692, 333247, H01L 2334, H01L 23053, H01L 2348

Patent

active

060491264

ABSTRACT:
A semiconductor module, includes a circuit including a plurality of semiconductor devices connected together as a package, wherein the plurality of semiconductor devices have a same device structure. Further, an amplifier includes a cascade-connection of a plurality of semiconductor device packages, wherein the plurality of semiconductor devices have a same device structure. Preferably, the devices include field-effect transistors (FETs), and an external input lead of a semiconductor package is connected to an input stage of the amplifier, an interstage circuit is connected between an intermediate output lead and an intermediate input lead, and an external output lead is connected to an output stage of the amplifier.

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T. Watanabe et al.; "Multichip IC for Cellular Handheld Telephones"; NEC Technical Journal, vol. 44, Nov. 1991, pp. 216-219.
Y. Yamashita et al.; GaAs Power Amplifier Module for Protable Telephones; National Technical Report, vol. 36, No. 4, Aug. 1990, pp. 34-38.
Panasonic News on Technical Information, No. 75, pp. 14-16.

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