Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent
1995-12-28
1998-12-15
Dutton, Brian
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
438612, H01L 2144
Patent
active
058496092
ABSTRACT:
An improved semiconductor package includes an insulating film carrying conductive balls disposed between a substrate and a printed circuit board. The conductive balls mounted in the insulating film are precisely connected to lower surfaces of conductive patterns formed at the substrate and pads of the printed circuit board. A method for mounting the improved semiconductor package on the printed circuit board includes aligning a package having a plurality of exposed electrical connect terminals with upper surfaces of a plurality of conductive balls formed in an insulating film, aligning lower surfaces of the conductive balls with a plurality of pads formed on the printed circuit board, and electrically connecting the exposed electrical connect terminals, the ends of the conductive balls and the pads of the printed circuit board by a reflow process.
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Dutton Brian
Lebentritt Michael S.
LG Semicon Co. Ltd.
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