Semiconductor package adapted for high-speed data processing...

Details Semiconductor package adapted for high-speed data processing... Semiconductor package adapted for high-speed data processing...

2007-09-12

2010-06-01

Prenty, Mark (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S778000

Reexamination Certificate

active

07728419

ABSTRACT:
A semiconductor package includes a semiconductor chip provided with a first surface having a bonding pad, a second surface opposing to the first surface and side surfaces; a first redistribution pattern connected with the bonding pad and extending along the first surface from the bonding pad to an end portion of the side surface which meets with the second surface; and a second redistribution pattern disposed over the first redistribution pattern and extending from the side surfaces to the first surface. In an embodiment of the present invention, in which the first redistribution pattern connected with the bonding pad is formed over the semiconductor chip and the second redistribution pattern is formed over the first redistribution pattern, it is capable of reducing a length for signal transfer since the second redistribution pattern is used as an external connection terminal. It is also capable of processing data with high speed, as well as protecting the semiconductor chip having weak brittleness, since the semiconductor package is connected to the substrate without a separate solder ball.

REFERENCES:
patent: 2009/0026591 (2009-01-01), Lee et al.
patent: 2001-75962 (2001-08-01), None
patent: 2004-105560 (2004-12-01), None

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