Semiconductor package

Details Semiconductor package Semiconductor package

2008-08-01

2009-02-24

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

C257S706000, C257S787000, C257S712000, C257SE23135

Reexamination Certificate

active

07495346

ABSTRACT:
There is provided a semiconductor package including: a substrate having a plurality of electrode pads on a surface thereof; a semiconductor chip mounted on the substrate, the semiconductor chip electrically connecting with the plurality of electrode pads; and a stiffener arranged on the substrate so as to surround the semiconductor chip. The stiffener includes: an insulating material layer; and a rigid plate mounted substantially parallel to a surface of the substrate in the insulating material layer, the rigid plate having formed therein a plurality of through holes, at least a part of the through holes being filled with the insulating material.

REFERENCES:
patent: 5485037 (1996-01-01), Marrs
patent: 6020221 (2000-02-01), Lim et al.
patent: 6432749 (2002-08-01), Libres
patent: 2001/0042863 (2001-11-01), Yamada et al.
patent: 2004/0036183 (2004-02-01), Im et al.
patent: 2004/0150118 (2004-08-01), Honda
patent: 2006/0249852 (2006-11-01), Chiu et al.
patent: 2007/0128889 (2007-06-01), Goto et al.
patent: 2007/0296079 (2007-12-01), Huang et al.
patent: 2003092376 (2003-03-01), None
patent: 2004260138 (2004-09-01), None
Notice of Allowance dated Dec. 28, 2008 re: U.S. Appl. No. 12/184,555.

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