Semiconductor package

Details Semiconductor package Semiconductor package

2006-05-24

2009-12-15

Sefer, A. (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S687000, C257S723000, C257SE21504

Reexamination Certificate

active

07633144

ABSTRACT:
Disclosed are a semiconductor package and a method of making the same. In the semiconductor package, a substrate and a semiconductor die are covered with and encapsulated by vertically pressing thermosetting resin having fluidity in a predetermined temperature range and denaturalizing itself in gel. Thus, it is possible to reduce a thickness of the semiconductor package and prevent wire sweeping.

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