Semiconductor package

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2004-07-22

2009-06-09

Clark, S. V. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S112000

Reexamination Certificate

active

07544541

ABSTRACT:
There is disclosed a method of making an electronic package (10) by: forming a metal base (50) on which to build the components of an electronic package; applying a mask layer (60) on the base to an area that is not to be occupied by interconnection pads (200) or die attachment pads (201) of the package; plating layers of metal on the un-masked areas of the base to form the interconnection and die attachment pads (200,201); removing the mask layer; mounting a semiconductor die (302) to at least one die attachment pad (201); electrically connecting the semiconductor die (302) to one or more interconnection pads (200); embedding the components on the base in an encapsulation material (300) to form a package; removing the metal base (50) to leave a package panel; and cutting the panel into discrete package units.

REFERENCES:
patent: 5900676 (1999-05-01), Kweon et al.
patent: 6700188 (2004-03-01), Lin
patent: 6773961 (2004-08-01), Lee et al.
patent: 6946324 (2005-09-01), McLellan et al.
patent: 7087462 (2006-08-01), Park et al.
patent: 7125747 (2006-10-01), Lee et al.
patent: 2001/0008305 (2001-07-01), McLellan et al.

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