Semiconductor package

Details Semiconductor package Semiconductor package

2007-10-09

2007-10-09

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S696000, C257S735000, C257S779000, C257SE23047, C257SE23048, C257SE23085

Reexamination Certificate

active

11049863

ABSTRACT:
A semiconductor package mainly includes a semiconductor chip and a plurality of L-shaped leads arranged at the periphery of the semiconductor chip. Each of the L-shaped leads has an inner lead portion exposed out of the lower surface of the semiconductor package and an outer lead portion formed substantially parallel to and adjacent to one of the side surfaces of the semiconductor package. The semiconductor chip has a plurality of bonding pads electrically coupled to the inner lead portions of the L-shaped leads. The semiconductor package is provided with a package body formed over the semiconductor chip and the inner lead portions of the L-shaped leads.

REFERENCES:
patent: 5451716 (1995-09-01), Hasegawa et al.
patent: 5835988 (1998-11-01), Ishii
patent: 6169323 (2001-01-01), Sakamoto
patent: 6424031 (2002-07-01), Glenn
patent: 6433418 (2002-08-01), Fujisawa et al.
patent: 6730544 (2004-05-01), Yang
patent: 6750545 (2004-06-01), Lee et al.
patent: 2002/0100963 (2002-08-01), Suzuki et al.

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