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2007-06-05

2007-06-05

Richards, N. Drew (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S123000

Reexamination Certificate

active

10358275

ABSTRACT:
A semiconductor package is provided which includes a semiconductor die which is formed in a die mounting area of a substrate. The die mounting area includes a frame with an opening formed therein, a die paddle, and a descending portion which connects the die paddle to the frame. The die mounting area forms a cavity to receive the semiconductor die such that an active surface of the semiconductor die is planar with the top surface of the substrate.

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