Semiconductor package

Details Semiconductor package Semiconductor package

2007-06-12

2007-06-12

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S710000, C257S711000, C257S501000, C257SE23183

Reexamination Certificate

active

11405825

ABSTRACT:
A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.

REFERENCES:
patent: 5182632 (1993-01-01), Bechtel et al.
patent: 5821161 (1998-10-01), Covell et al.
patent: 6303974 (2001-10-01), Irons et al.
patent: 6720647 (2004-04-01), Fukuizumi

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