Semiconductor package

Details Semiconductor package Semiconductor package

1978-03-20

1982-05-11

James, Andrew J.

357 52, 357 72, 357 74, 357 68, 29588, H01L 2934, H01L 2328, H01L 2302

Patent

active

043297013

ABSTRACT:
An improved semiconductor package is disclosed wherein a semiconductor wafer assembly includes first and second generally planar surfaces having respective first and second membrane members in overlying relationship thereto. Encompassing the periphery of the wafer assembly is a mass of retaining material, such as epoxy resin, which may overlie outer edge portions of the wafer assembly and sealingly engage the first and second membrane members. In a preferred embodiment, the semiconductor wafer assembly comprises a thyristor having a gate associated therewith having conductor means attached thereto which are embedded in a suitable layer of adhesive material which is disposed between the wafer assembly and the mass of retaining material. Another feature of the invention includes the provision of a temperature sensing element, such as a thermistor, which is disposed in intimate heat exchange relationship to the wafer assembly so as to accurately sense its operating temperature. In order to provide such heat exchange relationship, the element is preferably disposed between one of the planar surfaces of the wafer assembly and its associated membrane member, which is made to conform at least partially to the outer surface of the temperature sensing element. The element is also embedded in the aforementioned layer of adhesive material and includes signal conductor means which pass through said layer and the mass of retaining material.

REFERENCES:
patent: 2758263 (1956-08-01), Robillard
patent: 2809332 (1957-10-01), Sherwood
patent: 2946935 (1960-07-01), Finn
patent: 3094765 (1963-06-01), Willecke
patent: 3182201 (1965-05-01), Skiar
patent: 3200310 (1965-08-01), Carman
patent: 3320495 (1967-05-01), Fox et al.
patent: 3328650 (1967-06-01), Boyer
patent: 3476988 (1969-11-01), Zido
patent: 3496427 (1970-02-01), Lee
patent: 3600650 (1971-08-01), Obenhaus

Affiliated with

Also associated with

Rating

Semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-759558