Semiconductor package

Details Semiconductor package Semiconductor package

2006-06-13

2006-06-13

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S737000, C257SE23100

Reexamination Certificate

active

07061078

ABSTRACT:
A semiconductor package includes a chip and a carrier. The chip has an active surface and a lateral surface. The active surface has a number of first bumps and a number of second bumps. The first bumps are spaced by the second bumps. The first bumps are farther from the lateral surface than the second bumps are. The carrier has a base and a number of first inner leads. Each first inner lead has a body portion and a distal end bonding portion. The width of the body portion is smaller than that of the distal end bonding portion. The distal end bonding portions are electrically bonded to the first bumps such that the chip is disposed on the carrier, and each of the body portions is located between the two adjacent second bumps.

REFERENCES:
patent: 5825081 (1998-10-01), Hosomi et al.
patent: 6867490 (2005-03-01), Toyosawa

Affiliated with

Also associated with

Rating

Semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3702369