Semiconductor package

Details Semiconductor package Semiconductor package

2006-08-15

2006-08-15

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S723000, C361S734000

Reexamination Certificate

active

07091607

ABSTRACT:
A semiconductor package includes a substrate, a chip, and at least one capacitor. The chip adheres to the substrate and has an active surface, a grounding area disposed on the active surface and at least one power pad mounted on the active surface. The capacitor is disposed on the grounding area of the chip and has a power end and a grounding end electrically connected to the grounding area. At least one bonding wire electrically connects the power end of the capacitor to the power pad.

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patent: 2004/0183209 (2004-09-01), Lin

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