Semiconductor package

Details Semiconductor package Semiconductor package

2006-07-18

2006-07-18

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S433000

Reexamination Certificate

active

07078799

ABSTRACT:
A semiconductor package includes a body having a cavity closed by a lid. In the cavity, an integrated-circuit chip is placed. Electrical connection leads are carried by the body. These leads have resilient inner terminal parts which lie in the cavity and are suitable for being in contact with electrical connection pads on the said chip. The lid acts so as to keep the said inner terminal parts of the leads in resilient contact on the electrical connection pads on the chip.

REFERENCES:
patent: 4918513 (1990-04-01), Kurose et al.
patent: 5274456 (1993-12-01), Izumi et al.
patent: 5753857 (1998-05-01), Choi
patent: 5789804 (1998-08-01), Matsuoka
patent: 2001/0036771 (2001-11-01), Farnworth et al.
patent: 2002/0057468 (2002-05-01), Masao
patent: 2002/0131782 (2002-09-01), Yamaguchi et al.
patent: 2 822 326 (2002-09-01), None
patent: WO 01/91193 (2001-11-01), None
Preliminary French Search Report, FR 03 05264, Oct. 1, 2003.

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