Semiconductor package

Details Semiconductor package Semiconductor package

2006-05-09

2006-05-09

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S676000

Reexamination Certificate

active

07042078

ABSTRACT:
A semiconductor package includes spacers, a chip, bonding wires, contacts, and an encapsulant. The chip is disposed on the spacers. The bonding wires are electrically connected to the chip, and the contacts are electrically connected to the bonding wires. The contacts are electrically connected to an external circuit board. The encapsulant encapsulates the spacers and the active and back surfaces of the chip so as to lower the thermal stress of the chip.

REFERENCES:
patent: 6593662 (2003-07-01), Pu et al.
patent: 6621156 (2003-09-01), Kimura

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