Semiconductor package

Details Semiconductor package Semiconductor package

2001-06-01

2002-07-02

Shooman, Ted (Department: 2912)

Equipment for production, distribution, or transformation of ene

Distribution, modification or control

Semiconductor, transistor or integrated circuit

Design Patent

active

D0459705

CLAIM:
The ornamental design for a semiconductor package, as shown and described.

REFERENCES:
patent: 3602846 (1971-08-01), Hauser
patent: 3846734 (1974-11-01), Pauza et al.
patent: 4391408 (1983-07-01), Hanlon et al.
patent: 4441119 (1984-04-01), Link
patent: D288922 (1987-03-01), Olla
patent: 4951122 (1990-08-01), Tsubosaki et al.
patent: 4979016 (1990-12-01), Lee
patent: 4987474 (1991-01-01), Yasuhara et al.
patent: D317592 (1991-06-01), Yoshizawa
patent: 5337216 (1994-08-01), McIver
patent: 5387814 (1995-02-01), Baudouin et al.
patent: D357901 (1995-05-01), Horman
patent: 5539250 (1996-07-01), Kitano et al.
patent: 5646443 (1997-07-01), Takahashi
patent: D401567 (1998-11-01), Farnworth et al.
patent: D401912 (1998-12-01), Majumdar et al.
patent: 5959842 (1999-09-01), Leonard et al.
patent: 6018191 (2000-01-01), Murakami et al.
patent: 6303982 (2001-10-01), Murakami et al.
Japanese Design Application No. 929231, Publication Date: Jul. 6, 1995.
Japanese Design Application No. 982886—Similar 1, Publication Date: Jun. 24, 1997.
Japanese Design Application No. 982886, Publication Date: Jun. 17, 1997.

Affiliated with

Also associated with

Rating

Semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2894035