Semiconductor package

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2011-08-02

2011-08-02

Andújar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S667000, C438S112000, C438S123000

Reexamination Certificate

active

07989930

ABSTRACT:
A semiconductor package includes a leadframe defining a die pad, a chip electrically coupled to the die pad, encapsulation material covering the chip and the die pad, and a plurality of lead ends exposed relative to the encapsulation material and configured for electrical communication with the chip, and a nitrogen-containing hydrocarbon coating disposed over at least the lead ends of the leadframe, where the hydrocarbon coating is free of metal particles.

REFERENCES:
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patent: 5960251 (1999-09-01), Brusic et al.
patent: 6614123 (2003-09-01), Lee et al.
patent: 6784536 (2004-08-01), Eslamy
patent: 7105383 (2006-09-01), Vo et al.
patent: 2002/0127776 (2002-09-01), Nakajo et al.
patent: 2004/0041241 (2004-03-01), Vo et al.
patent: 61048953 (1986-03-01), None
patent: 06244340 (1994-09-01), None
patent: 09172121 (1997-06-01), None
patent: 2004200349 (2004-07-01), None
patent: 2004200350 (2004-07-01), None
ENTEK PLUS Process, PWB Copper Protective Coating System, Teamwork Across the Board, Nov. 1993 (1 pg.).

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