Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2008-07-01
2008-07-01
Nguyen, Dao H (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S678000, C257S679000, C257S777000, C257SE23033, C257SE23180, C438S109000, C438S119000
Reexamination Certificate
active
07394147
ABSTRACT:
A semiconductor package includes a substrate, a first chip, a nonconductive adhesive, a second chip and a plurality of supporting balls. The first chip has an upper surface and a lower surface opposite to the upper surface, and the lower surface is mounted on the substrate. The nonconductive adhesive is disposed on the upper surface of the first chip. The second chip has an upper surface and a lower surface opposite to the upper surface, wherein the lower surface is mounted on the upper surface of the first chip by means of the nonconductive adhesive, and the adherent area between the nonconductive adhesive and the second chip is larger than 90% of the area of the lower surface of the second chip. The supporting balls are disposed in the nonconductive adhesive for supporting the second chip.
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Lin Yi Cheng
Lu Hung Yuan
Sun Kuo Yang
Tsai Wei Chin
Yang Chia Ming
Nguyen Dao H
Orient Semiconductor Electronics Limited
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