Semiconductor package

Details Semiconductor package Semiconductor package

2011-06-14

2011-06-14

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S734000, C257S786000, C257SE23020

Reexamination Certificate

active

07960837

ABSTRACT:
In a semiconductor package, at least two of connection pads are formed into different-shape pads which are different in planar shape from other connection pads, and one different-shape pad and another different-shape pad are disposed in a manner that, when the position of the one different-shape pad is rotated about the center point of the semiconductor package, the position does not coincide with the disposition position of the other different-shape pad.

REFERENCES:
patent: 6118670 (2000-09-01), Radford et al.
patent: 6177733 (2001-01-01), Obara
patent: 6531782 (2003-03-01), Jones et al.
patent: 7417309 (2008-08-01), Takahashi et al.
patent: 2008/0185735 (2008-08-01), Pham et al.
patent: 6-79147 (1994-11-01), None

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