Semiconductor package

Details Semiconductor package Semiconductor package

2011-06-14

2011-06-14

Smith, Matthew (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257SE23008, C438S109000

Reexamination Certificate

active

07960820

ABSTRACT:
A semiconductor package in which an electronic device chip is provided in a cavity of a silicon substrate stacked product constituted by stacking a plurality of silicon substrates.

REFERENCES:
patent: 4910584 (1990-03-01), Mizuo
patent: 5495398 (1996-02-01), Takiar et al.
patent: 6343019 (2002-01-01), Jiang et al.
patent: 6949835 (2005-09-01), Konishi et al.
patent: 2005/0173811 (2005-08-01), Kinsman
patent: 2007-208041 (2007-08-01), None

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