Semiconductor package

Details Semiconductor package Semiconductor package

2011-03-22

2011-03-22

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S702000, C361S710000, C165S104260, C165S104330, C257S714000, C438S122000

Reexamination Certificate

active

07911794

ABSTRACT:
A semiconductor package includes a package main body having a base portion and a semiconductor device accommodating portion, electric terminals electrically connected to a semiconductor device in the accommodating portion and exposed to an outer surface, and a high heat transfer element disposed in the base portion to extend from a heat generation site corresponding position corresponding to a heat generating site of the semiconductor device to a position in an outside of the heat generation site corresponding position. The base portion is configured by bringing a plurality of thin plates in close contact with each other to bond them integrally, and the high heat transfer element includes at least one combination of fluid passage formed in the base portion and a heat transfer fluid sealed in the passage, or at least one heat pipe.

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