Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent
1990-09-18
1991-11-26
Zimmerman, John J.
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
428621, 428632, B32B 1504
Patent
active
050681567
ABSTRACT:
A semiconductor package in which a ceramic substrate is joined to a copper stud by brazing. Between the substrate and the stud, first and second members are each fixed in place with a brazing material. The first member has a thermal expansion coefficient intermediate those of the copper stud and the ceramic substrate for reducing the thermal stress generated in the ceramic substrate. The second member prevents the ceramic substrate from being deformed by thermal stress. If the first member is, e.g., a Cu-W alloy used as the neck on the copper stud, it is possible to reduce the compressive stress generated in the ceramic substrate during cooling after the brazing. Further, the influence on the substrate by bimetallic deformation as a result of the combination of the copper stud and the Cu-W alloy is mitigated by a flexible second member, e.g., a copper foil. Thus, the ceramic substrate is brazed without involving any substantial stress thereon.
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Mitsubishi Denki & Kabushiki Kaisha
Zimmerman John J.
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