Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1997-12-08
2000-04-18
Cuchlinski, Jr., William A.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257691, 693703, H05K 506
Patent
active
060517840
ABSTRACT:
Disclosed herein is a semiconductor package having a wire bonding structure. The semiconductor package includes a packaging substrate having a multi-stepped opening extending to a selected depth from the surface of the substrate. The area of the opening decreases as the level from the upper surface decreases. The substrate also includes: a die attach region positioned at the lowest bottom plane of the multi-stepped opening, on which the semiconductor chip is attached; a step plane formed at the upper step plane over the die attach region, on which a plurality of first interconnections for signal transfer paths are printed; and a plurality of outer leads electrically connected to the plurality of first interconnections the plurality of alter leads, projected outwards from the packaging substrate. There is also provided in the package a connecting member having a through hole at its central portion and a plurality of second interconnections at its circumference. The interconnections are insulated from another one. The connecting member is mounted on the step plane of the packaging substrate.
REFERENCES:
patent: 4814943 (1989-03-01), Okuaki
patent: 4833102 (1989-05-01), Byrne et al.
patent: 5568684 (1996-10-01), Wong
patent: 5689089 (1997-11-01), Polak et al.
Cuchlinski Jr. William A.
Hyundai Electronics Industries Co,. Ltd.
Mancho Ronnie
LandOfFree
Semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2337614