1989-05-30
1990-04-10
James, Andrew J.
357 68, 357 71, 357 72, 357 80, 357 81, 357 84, H01L 2348
Patent
active
049165194
ABSTRACT:
In an encapsulated semiconductor module in which a semiconductor chip, having a major surface with terminals thereon, is deposed within the encapsulating material, a plurality of self-supporting, unitary, discrete, and continuous lead frame conductors formed of metal sheet stock are positioned at various locations around the chip and cantilevered out of the encapsulating material, so that discrete wires can be used to connect respective ones of said conductors to respective ones of said terminals. In the present invention excessively long bonding wires are avoided by connecting a selected one of said lead frame conductors to a parallel conductor by a jumper wire and connecting the parallel conductor to the desired terminal with a short wire.
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Supplement to Electronic News, 8-15-75.
Co-pending application, Ser. No. 161,319, filed Feb. 19, 1988.
International Business Machines - Corporation
James Andrew J.
Pemrick James W.
Thornton Francis J.
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