Semiconductor package

Details Semiconductor package Semiconductor package

1975-02-03

1977-03-15

Wojciechowicz, Edward J.

357 70, 357 81, H01L 2328, H01L 2348, H01L 2302

Patent

active

040127680

ABSTRACT:
A high heat dissipating integrated circuit device having a large heat sink metalic portion surrounding the plastic encapsulation material of the semiconductor chip. The semiconductor chip is mounted in electrically insulated, close conjunction with the heat sink such that high heat dissipation is provided. The heat sink portion is conveniently formed surrounding most of the plastic encapsulation to provide for maximum heat dissipation from the device. The device provides for heat dissipation in the ten to higher watt range.

REFERENCES:
patent: 3629668 (1971-12-01), Hingorany
patent: 3820153 (1974-06-01), Quinn

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