Semiconductor package

Details Semiconductor package Semiconductor package

1988-01-04

1989-12-19

Grimley, A. T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29827, H01L 2310, H01L 2336

Patent

active

048884499

ABSTRACT:
A semiconductor package for an electrical component which has a metal or metal alloy leadframe with first and second surface, which leadframe is adapted to have an electrical component connected thereto. The leadframe is bonded by means of a polymer to a copper or copper alloy base member. The leadframe is also bonded by means of a polymer to a copper or copper alloy cap member. The cap and base members have coated to their inside surfaces a metal or metal alloy. The coating improves the polymer bond between the leadframe and the base and cap members. The surface area of the base member is increased to transfer more heat from the silicon chip in the semiconductor package and to reduce the thermal stresses between the silicon chip and the base member.

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