Semiconductor package

Details Semiconductor package Semiconductor package

1989-08-01

1991-01-15

Hille, Rolf

357 74, H01L 2314, H01L 2312

Patent

active

049857533

ABSTRACT:
A semiconductor package comprises a package having a cavity for accommodating therein at least one semiconductor chip, at least one dielectric substrate with a peripheral circuit disposed thereon and one substrate cracking prevention plate, the cavity having therein a flat surface on which the semiconductor chip, the dielectric substrate and the substrate cracking prevention plate with a chip carrier can be mounted together.

REFERENCES:
patent: 3936864 (1976-02-01), Benjamin
patent: 3946428 (1976-03-01), Anazawo et al.
patent: 4259684 (1981-03-01), Dean et al.

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