Semiconductor package

Details Semiconductor package Semiconductor package

1991-11-27

1993-10-05

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 524, 361764, 361777, H05K 702

Patent

active

052511073

ABSTRACT:
A quadrate semiconductor element in the form of a quad flat package, a bare chip, and the like mounted on a substrate has a plurality of first terminals electrically connected through connecting wires to corresponding second terminals which are disposed on the substrate around the semiconductor element. The second terminals are disposed on the substrate such that the number of second terminals per unit area is less at locations near the corners of the quadrate semiconductor element than at the other portions of the substrate. This arrangement enlarges the effective wiring area for the connecting wires at the corners, thus greatly improving wiring efficiency.

REFERENCES:
patent: 4618739 (1986-10-01), Theobald
patent: 4822550 (1989-04-01), Komathu

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