Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate
2007-10-22
2010-11-09
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
C257SE23023, C257S773000, C257S780000, C257S786000
Reexamination Certificate
active
07830022
ABSTRACT:
A semiconductor package is disclosed. One embodiment provides a semiconductor package singulated from a wafer includes a chip defining an active surface, a back side opposite the active surface, and peripheral sides extending between the active surface and the back side; a contact pad disposed on the active surface; and a metallization layer extending from the contact pad onto a portion of the peripheral sides of the chip.
REFERENCES:
patent: 5450055 (1995-09-01), Doi
patent: 5639013 (1997-06-01), Jairazbhoy et al.
patent: 5656547 (1997-08-01), Richards et al.
patent: 5684677 (1997-11-01), Uchida et al.
patent: 5818107 (1998-10-01), Pierson et al.
patent: 5936846 (1999-08-01), Jairazbhoy et al.
patent: 6285085 (2001-09-01), Taguchi
patent: 6597059 (2003-07-01), McCann et al.
patent: 7019397 (2006-03-01), Ohuchi et al.
patent: 2006/0118938 (2006-06-01), Tandy
Edward Furgut, “Taking Wafer Level Packaging to the Next Stage: A 200 mm Silicon Technology Compatible Embedded Device Technology”, SEMICON Europa 2006, Munich, Germany (17 pgs).
M. Brunnbauer, “An Embedded Device Technology Based on a Molded Reconfigured Wafer”, 2006 ECTC San Diego, May 31-Jun. 1, 2006 (5 pgs.).
Koller Adolf
Theuss Horst
Chu Chris
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
LandOfFree
Semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4205571