Semiconductor package

Details Semiconductor package Semiconductor package

2007-10-22

2010-11-09

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257SE23023, C257S773000, C257S780000, C257S786000

Reexamination Certificate

active

07830022

ABSTRACT:
A semiconductor package is disclosed. One embodiment provides a semiconductor package singulated from a wafer includes a chip defining an active surface, a back side opposite the active surface, and peripheral sides extending between the active surface and the back side; a contact pad disposed on the active surface; and a metallization layer extending from the contact pad onto a portion of the peripheral sides of the chip.

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patent: 7019397 (2006-03-01), Ohuchi et al.
patent: 2006/0118938 (2006-06-01), Tandy
Edward Furgut, “Taking Wafer Level Packaging to the Next Stage: A 200 mm Silicon Technology Compatible Embedded Device Technology”, SEMICON Europa 2006, Munich, Germany (17 pgs).
M. Brunnbauer, “An Embedded Device Technology Based on a Molded Reconfigured Wafer”, 2006 ECTC San Diego, May 31-Jun. 1, 2006 (5 pgs.).

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