Semiconductor package

Details Semiconductor package Semiconductor package

1992-10-22

1994-07-05

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361730, 361760, 361752, 174259, 174260, 257690, H01L 2302

Patent

active

053269322

ABSTRACT:
A semiconductor package comprising a semiconductor chip received in and attached to a cavity of a base made of a ceramic or aluminum, by means of an adhesive, a lid fixedly attached to the upper surface of the semiconductor chip, the lid having a plurality of solder bumps being in contact with bonding pads of the semiconductor chip and a plurality of metal contacts formed on the solder bumps of the lid. The lid comprises an insulating polyimide film or a rectangular plate made of a nonconductive ceramic material. The semiconductor package eliminates the use of a lead frame and metal wires, thereby enabling the manufacture thereof to be simplified. It also achieves a simplification, a lightness, a thinness, a compactness in construction. With the simplified construction, a reduction in manufacture cost and an improvement in productivity are achieved. In manufacturing semiconductor devices, the semiconductor package also provides an improvement in the degree of dense integration.

REFERENCES:
patent: 5136366 (1992-08-01), Worp et al.
patent: 5138436 (1992-08-01), Koepf
patent: 5139969 (1992-08-01), Mori
patent: 5153379 (1992-10-01), Guzuk et al.
patent: 5153385 (1992-10-01), Juskey et al.
patent: 5159434 (1992-10-01), Kohno et al.
patent: 5166772 (1992-11-01), Soldner et al.
Papageorge, M., et al., "Double Layer Recessed Hybrid Flip Chip on Board", Motorola Technical Developments, vol. 11, pp. 158-159 (1990).
"Thin Film Module", IBM Technical Disclosure Bulletin, vol. 31, No. 8, pp. 135-138 (1989).
Patent Abstracts of Japan, vol. 14, No. 117 (E-898) (1990), JP 1--313969.
Patent Abstracts of Japan, vol. 15, No. 295 (E-1094) (1991), JP 3-105924.
Patent Abstracts of Japan, vol. 15, No. 383 (E-1116) (1991), JP 3-154344.
Patent Abstracts of Japan, vol. 15, No. 315 (E-1099) (1991), JP 3-116838.

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