Semiconductor package

Details Semiconductor package Semiconductor package

1992-10-02

1994-04-19

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 522, 257787, 361728, 361775, H01L 2302, H01L 2328

Patent

active

053047370

ABSTRACT:
A semiconductor package comprising a connection pad device for electrically connecting at least a part of chip pads of a semiconductor chip with the corresponding inner leads of a lead frame. The connection pad device comprises a film as a connection pad device body, a plurality of copper foil wirings each having one end positioned to correspond to each chip pad of the semiconductor chip and the other end positioned to correspond to each inner lead of the lead frame, a plurality of first jumper pads protruded from the film, each of the first jumper pads being connected to one end of each corresponding copper foil wiring and wire-bonded to each corresponding chip pad, and a plurality of second jumper pads protruded from the film, each of the second jumper pads being connected to the other end of each corresponding copper foil wiring and wire-bonded to each corresponding inner lead. With the connection pad device, the semiconductor package can cope properly with various package types and have improvements in the degree of freedom in designing layouts of the semiconductor chip and lead frame.

REFERENCES:
patent: 4208698 (1980-06-01), Narasimhan
patent: 4534105 (1985-08-01), Reusch
patent: 4641114 (1987-02-01), Person

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