Semiconductor-on-diamond devices and methods of forming

Active solid-state devices (e.g. – transistors – solid-state diode – Semiconductor is an oxide of a metal or copper sulfide

Reexamination Certificate

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C257S507000

Reexamination Certificate

active

07863606

ABSTRACT:
The present invention provides semiconductor-on-diamond devices, and methods for the formation thereof. In one aspect, a mold is provided which has an interface surface configured to inversely match a configuration intended for the device surface of a diamond layer. An adynamic diamond layer is then deposited upon the diamond interface surface of the mold, and a substrate is joined to the growth surface of the adynamic diamond layer. At least a portion of the mold can then be removed to expose the device surface of the diamond which has received a shape which inversely corresponds to the configuration of the mold's diamond interface surface. The mold can be formed of a suitable semiconductor material which is thinned to produce a final device. Optionally, a semiconductor material can be coupled to the diamond layer subsequent to removal of the mold.

REFERENCES:
patent: 4952832 (1990-08-01), Imai et al.
patent: 5096465 (1992-03-01), Chen et al.
patent: 5130111 (1992-07-01), Pryor
patent: 5131963 (1992-07-01), Ravi
patent: 5173089 (1992-12-01), Tanabe et al.
patent: 5221870 (1993-06-01), Nakahata et al.
patent: 5329208 (1994-07-01), Imai et al.
patent: 5355568 (1994-10-01), Imai et al.
patent: 5366579 (1994-11-01), Yamazaki et al.
patent: 5374293 (1994-12-01), Takashita et al.
patent: 5380349 (1995-01-01), Taniguchi et al.
patent: 5390401 (1995-02-01), Shikata et al.
patent: 5401544 (1995-03-01), Nakahata et al.
patent: 5446329 (1995-08-01), Nakahata et al.
patent: 5576589 (1996-11-01), Dreifus et al.
patent: 5633088 (1997-05-01), Pinneo
patent: 5656828 (1997-08-01), Zachai et al.
patent: 5660881 (1997-08-01), Okamura
patent: 5731046 (1998-03-01), Mistry et al.
patent: 5776246 (1998-07-01), Tanabe et al.
patent: 5776355 (1998-07-01), Martin
patent: 5827613 (1998-10-01), Nakayama et al.
patent: 5925154 (1999-07-01), Semenov et al.
patent: 6039641 (2000-03-01), Sung
patent: 6051063 (2000-04-01), Tanabe et al.
patent: 6121066 (2000-09-01), Ju et al.
patent: 6159286 (2000-12-01), Sung
patent: 6159604 (2000-12-01), Adachi
patent: 6210780 (2001-04-01), Fujii et al.
patent: 6222299 (2001-04-01), Graebner et al.
patent: 6275123 (2001-08-01), Tanaka et al.
patent: 6278342 (2001-08-01), Ella
patent: 6531226 (2003-03-01), Petkie
patent: 6659161 (2003-12-01), Sung
patent: 6814130 (2004-11-01), Sung
patent: 6830813 (2004-12-01), Ravi
patent: 6936497 (2005-08-01), Ravi et al.
patent: 7011134 (2006-03-01), Sung
patent: 7084432 (2006-08-01), Kachi et al.
patent: 7132309 (2006-11-01), Sung
patent: 2006/0174823 (2006-08-01), Sung
patent: 2006/0186556 (2006-08-01), Sung
patent: 2006/0249748 (2006-11-01), Piner et al.
U.S. Appl. No. 11/323,187 filed Aug. 24, 2006, Chien-Min Sung. Office action issued Feb. 26, 2010.
U.S. Appl. No. 11/899,953 filed Sep. 6, 2007, Chien-min Sung. Office action issued Apr. 5, 2010.

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