Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1996-09-25
1999-12-14
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
B05D 100, B05C 300
Patent
active
060012153
ABSTRACT:
Semiconductor nitride film etching systems are provided using a hot phosphoric-acid-based treatment solution, wherein the systems contain means for measuring phosphoric acid concentration, silicon concentration, fluorine concentration, or specific gravity or a combination thereof, and additives of the treatment solution are controlled or the treatment solution is exchanged. The concentration of components of the treatment solution, particularly the concentration of silicon, is controlled, thus providing stabilization of the etching rate of a silicon nitride film, and stable control of the etching selection ratio.
REFERENCES:
patent: 3772105 (1973-11-01), Shipley
patent: 4092211 (1978-05-01), Morris
patent: 4540465 (1985-09-01), Coggins et al.
patent: 4865877 (1989-09-01), Yamaguchi et al.
patent: 5227010 (1993-07-01), Lubert et al.
patent: 5470421 (1995-11-01), Nakada et al.
patent: 5472562 (1995-12-01), Ziger
Patent Abstracts of Japan, JP 07-230981, Aug. 29, 1995.
Patent Abstracts of Japan, vol. 16, No. 472 (E-1272), Sep. 30, 1992, JP 4-170029, Jun. 17, 1992.
Patent Abstracts of Japan, vol. 14, No. 374 (E-964), Aug. 13, 1990, JP 2-137228, May 25, 1990.
Patent Abstacts of Japan, vol. 12, No. 168 (E-611), May 20, 1988, JP 62-281335, Dec. 7, 1987.
Dang Thi
Mitsubishi Denki & Kabushiki Kaisha
LandOfFree
Semiconductor nitride film etching system does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor nitride film etching system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor nitride film etching system will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-859552