Semiconductor mounting producing efficient heat dissipation

Details Semiconductor mounting producing efficient heat dissipation Semiconductor mounting producing efficient heat dissipation

1977-08-24

1980-06-24

Miller, Stanley D.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

357 82, 165 80C, H01L 2302, H01L 2504

Patent

active

042097991

ABSTRACT:
In order to efficiently dissipate heat from both sides of a semiconductor vice to an associated cooling element, the device is contacted at its two load current conducting sides by conductive contacting elements and the contacting elements are both firmly connected to the cooling element in a thermally conductive and electrically insulating manner.

REFERENCES:
patent: 2730663 (1956-01-01), Harty
patent: 2862159 (1958-11-01), Wayworth
patent: 2907935 (1959-10-01), Nagorsen
patent: 3396361 (1968-08-01), Sussman
patent: 3483444 (1969-12-01), Parrish
patent: 3739234 (1973-06-01), Bylund et al.
patent: 3768548 (1973-10-01), Dilay et al.
patent: 3834454 (1974-09-01), Gammel et al.
patent: 3918084 (1975-11-01), Schierz
patent: 4020399 (1977-04-01), Suzuki et al.
patent: 4036291 (1977-07-01), Kobayashi et al.
patent: 4047197 (1977-09-01), Schierz

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