Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2005-02-01
2005-02-01
Nguyen, Cuong (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
66, 66
Reexamination Certificate
active
06849933
ABSTRACT:
A semiconductor device of a high heat radiation type having improved reliability is disclosed. The semiconductor device comprises a semiconductor chip with plural bonding pads formed thereon, plural inner leads, plural bonding wires for connecting the bonding pads and the inner leads with each other, a heat spreader having a chip supporting surface for supporting the semiconductor chip and also having a rear surface exposed to the exterior, a chip bonding material for bonding the semiconductor chip and the heat spreader with each other, a resin body which seals the semiconductor chip with a sealing resin, and plural outer leads projecting to the exterior from the resin body. A protruding portion protruding upward from the chip supporting surface is formed around the chip on the chip supporting surface of the heat spreader, thereby relieving a thermal stress imposed on an end portion of the chip bonding material and improving the reliability of a QFP as the semiconductor device.
REFERENCES:
patent: 5892278 (1999-04-01), Horita et al.
patent: 6198163 (2001-03-01), Crowley et al.
patent: 6246111 (2001-06-01), Huang et al.
patent: 6-295963 (1994-10-01), None
Koike Nobuya
Shimizu Ichio
Miles & Stockbridge P.C.
Nguyen Cuong
Renesas Technology Corp.
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