Semiconductor mounting board

Details Semiconductor mounting board Semiconductor mounting board

2006-03-29

2010-06-15

Levi, Dameon E (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S760000, C361S790000, C361S808000, C361S735000, C361S728000, C174S255000, C174S262000, C174S264000

Reexamination Certificate

active

07738258

ABSTRACT:
A semiconductor mounting board80is prepared by electrically joining an IC chip70via an interposer60of high rigidity to external pads41and internal pads43, which are formed on the uppermost surface of a build-up layer30. When the IC chip70generates heat, since pads41are positioned away from the center, a large shearing stress is applied to the portions at which pads41are joined to the interposer60in comparison to the portions at which pads43are joined to the interposer60. Here, pads41are formed at substantially flat wiring portions and thus when joined to the interposer60by means of solder bumps51, voids and angled portions, at which stress tends to concentrate, are not formed in the interiors of solder bumps51. The joining reliability is thus high.

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