Semiconductor mount

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal

Reexamination Certificate

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Details

C257S431000, C257S432000, C257SE31127, C257SE27123, C438S022000, C438S029000

Reexamination Certificate

active

07855423

ABSTRACT:
A mount for a semiconductor device has a first surface with at least one contact region and a second surface. The mount has a substrate to receive the second surface of the semiconductor device and a planar element. The planar element has an aperture sized to surround the semiconductor. A first surface of the planar element is mounted to the substrate and is located to surround the semiconductor device such that the semiconductor device is aligned by the aperture. The mount further has means for mounting the semiconductor device to the substrate in an aligned position. Some embodiments include a method of making and/or using such a mount.

REFERENCES:
patent: 6011215 (2000-01-01), Glatfelter et al.
patent: 2005/0046977 (2005-03-01), Shifman
patent: 2006/0169315 (2006-08-01), Levin
patent: 2007/0256725 (2007-11-01), Fork et al.
patent: 2008/0000516 (2008-01-01), Shifman
patent: 2008/0123313 (2008-05-01), Horne
Bett, A.W. et al., “Flatcon and Flashcon Concepts for High Concentration PV”, 19th European Photovoltaic Solar Energy Conference, Paris, Jun. 7-11, 2004, 4 pgs.
Gordon, Jeffrey M. et al., “Optical Performance at the Thermodynamic Limit with Tailored Imaging Designs”, Applied Optics, Dec. 2004, pp. 1-16.
Mulligan, W.P. et al., “A Flat-Plate Concentrator Micro-Concentrator Design Overview”, IEEE, 2000, pp. 1495-1497.
Swanson, Richard M., “The Promise of Concentrators”, Prog. Photovolt. Res. Appl. 8, 2000, pp. 93-111.
Nguyen, Luu, “Wafer Level Packaging for Analog/Mixed Signal Applications”, MEPTEC Int. Wafer Level Packaging Conference, Aug. 22, 2002, pp. 1-41.

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