Semiconductor module with two cooling surfaces and method

Details Semiconductor module with two cooling surfaces and method Semiconductor module with two cooling surfaces and method

2011-04-05

2011-04-05

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S713000, C257S717000, C257S720000, C257S722000, C257SE33075, C257SE23051, C257SE23080, C257SE23103, C257SE23105, C438S122000, C361S688000, C361S702000, C361S703000, C361S709000, C174S548000

Reexamination Certificate

active

07919854

ABSTRACT:
A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a second cooling surface. The first cooling surface is arranged in a first plane, the second cooling surface is arranged in a second plane, at an angle different from 0° relative to the first plane.

REFERENCES:
patent: 4918511 (1990-04-01), Brown
patent: 6903457 (2005-06-01), Nakajima et al.
patent: 102008033465 (2009-01-01), None

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