Semiconductor module with snap line

Details Semiconductor module with snap line Semiconductor module with snap line

1997-05-19

1998-06-16

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257703, 257725, H01L 2334

Patent

active

057675767

ABSTRACT:
A semiconductor module includes a ceramic substrate for mounting plural semiconductor chips. Even if cracks and cleavages are formed in the ceramic substrate, further damages, such as lowering dielectric or insulation strength is prevented. The semiconductor module includes IGBTs arranged on one ceramic substrate soldered to a metal base plate, and the upper surface of the ceramic substrate is divided into zones. On each zone, a copper foil with one IGBT is mounted. A snap line is formed between the zones to localize the cracks and cleavages formed by bending stress to the snap line. The copper foils on the zones are connected to each other by a conductor bridge disposed over the snap line.

REFERENCES:
patent: 5291065 (1994-03-01), Arai et al.

Affiliated with

Also associated with

Rating

Semiconductor module with snap line does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor module with snap line, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor module with snap line will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1729277