Semiconductor module with serial bus connection to multiple...

Electricity: electrical systems and devices – Safety and protection of systems and devices – Impedance insertion

Reissue Patent

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C361S707000, C361S709000, C361S728000, C361S747000, C361S748000, C361S749000, C326S030000

Reissue Patent

active

RE042429

ABSTRACT:
A semiconductor module is provided which includes adelete-start id="REI-00001" date="20110607" ?beatdelete-end id="REI-00001" ?insert-start id="REI-00002" date="20110607" ?heatinsert-end id="REI-00002" ?spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of the semiconductorsinsert-start id="REI-00003" date="20110607" ?.insert-end id="REI-00003" ?The semiconductor module also includes a termination resistor electrically coupled to at least one of the semiconductors. A method of making a semiconductor module is also taught, whereby a plurality of electrically conductive leads are provided. At least two semiconductors are electrically coupled to the plurality of electrically conductive leads, where at least one of the electrically conductive leads is common to both of the semiconductors. The semiconductors are then thermally coupled to a heat spreader. Subsequently, a termination resistor is electrically coupled to at least one of the semiconductors.

REFERENCES:
patent: 3506877 (1970-04-01), Owen
patent: 3654580 (1972-04-01), Laisi
patent: 3868724 (1975-02-01), Perrino
patent: 4314270 (1982-02-01), Iwatani
patent: 4377855 (1983-03-01), Lavi
patent: 4737903 (1988-04-01), Nishikawa et al.
patent: 4811165 (1989-03-01), Currier et al.
patent: 4858073 (1989-08-01), Gregory
patent: 4879588 (1989-11-01), Ohtsuka et al.
patent: 4914551 (1990-04-01), Anschel et al.
patent: 5045921 (1991-09-01), Lin et al.
patent: 5066250 (1991-11-01), Welsh
patent: 5090920 (1992-02-01), Casey
patent: 5161986 (1992-11-01), Gulbranson et al.
patent: 5179501 (1993-01-01), Ocken et al.
patent: 5213868 (1993-05-01), Liberty et al.
patent: 5214318 (1993-05-01), Nakanishi et al.
patent: 5224023 (1993-06-01), Smith et al.
patent: 5229916 (1993-07-01), Frankeny et al.
patent: 5268813 (1993-12-01), Chapman
patent: 5276418 (1994-01-01), Klosowiak et al.
patent: 5315153 (1994-05-01), Nagai et al.
patent: 5386341 (1995-01-01), Olson et al.
patent: 5468999 (1995-11-01), Lin et al.
patent: 5477933 (1995-12-01), Nguyen
patent: 5485351 (1996-01-01), Hopfer et al.
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5527998 (1996-06-01), Anderson et al.
patent: 5550406 (1996-08-01), McCormick
patent: 5640305 (1997-06-01), Smithers
patent: 5663661 (1997-09-01), Dillon et al.
patent: 5703436 (1997-12-01), Forrest et al.
patent: 5751553 (1998-05-01), Clayton
patent: 5763952 (1998-06-01), Lynch et al.
patent: 5764489 (1998-06-01), Leigh et al.
patent: 5777345 (1998-07-01), Loder et al.
patent: 5785535 (1998-07-01), Brodsky et al.
patent: 5804004 (1998-09-01), Tuckerman et al.
patent: 5808870 (1998-09-01), Chiu
patent: 5925934 (1999-07-01), Lim
patent: 5926369 (1999-07-01), Ingraham et al.
patent: 5926951 (1999-07-01), Khandros et al.
patent: 5936850 (1999-08-01), Takahashi et al.
patent: 5940721 (1999-08-01), Kinzer et al.
patent: 5949657 (1999-09-01), Karabatsos
patent: 5954536 (1999-09-01), Fuerst et al.
patent: 5959839 (1999-09-01), Gates
patent: 5963427 (1999-10-01), Bollesen
patent: 5995370 (1999-11-01), Nakamori
patent: 5998864 (1999-12-01), Khandros et al.
patent: 6002589 (1999-12-01), Perino et al.
patent: 6005778 (1999-12-01), Spielberger et al.
patent: 6007357 (1999-12-01), Perino et al.
patent: 6009487 (1999-12-01), Davis et al.
patent: 6023103 (2000-02-01), Chang et al.
patent: 6034878 (2000-03-01), Osaka et al.
patent: 6040624 (2000-03-01), Chambers et al.
patent: 6049476 (2000-04-01), Laudon et al.
patent: 6072700 (2000-06-01), Nam
patent: 6093969 (2000-07-01), Lin
patent: 6094075 (2000-07-01), Garrett, Jr. et al.
patent: 6115909 (2000-09-01), Miller
patent: 6133629 (2000-10-01), Han et al.
patent: 6137682 (2000-10-01), Ishimine et al.
patent: 6172895 (2001-01-01), Brown et al.
patent: 6180881 (2001-01-01), Isaak
patent: 6181002 (2001-01-01), Juso et al.
patent: 6184587 (2001-02-01), Khandros et al.
patent: 6185122 (2001-02-01), Johnson et al.
patent: 6212073 (2001-04-01), Yamaguchi
patent: 6215182 (2001-04-01), Ozawa et al.
patent: 6229217 (2001-05-01), Fukui et al.
patent: 6234820 (2001-05-01), Perino et al.
patent: 6273759 (2001-08-01), Perino et al.
patent: 6341971 (2002-01-01), Choy et al.
patent: 6356106 (2002-03-01), Greeff et al.
patent: 6376904 (2002-04-01), Haba et al.
patent: 6404660 (2002-06-01), Gamini et al.
patent: 6449159 (2002-09-01), Haba
patent: 6490325 (2002-12-01), Fiedler et al.
patent: 6496889 (2002-12-01), Perino et al.
patent: 6514794 (2003-02-01), Haba et al.
patent: 6520789 (2003-02-01), Daugherty, Jr. et al.
patent: 6530062 (2003-03-01), Liaw et al.
patent: 6532157 (2003-03-01), Glenn et al.
patent: 6545875 (2003-04-01), Perino et al.
patent: 6590781 (2003-07-01), Kollipara et al.
patent: 6608507 (2003-08-01), Garrett, Jr. et al.
patent: 6618938 (2003-09-01), Alagaratnam et al.
patent: 6621373 (2003-09-01), Mullen et al.
patent: 6657871 (2003-12-01), Perino et al.
patent: 6705388 (2004-03-01), Sorgo
patent: 6721189 (2004-04-01), Haba
patent: 6751192 (2004-06-01), Nakata
patent: 6754129 (2004-06-01), Khatri et al.
patent: 6765800 (2004-07-01), Haba et al.
patent: 6784526 (2004-08-01), Mezawa
patent: 6833984 (2004-12-01), Belgacem
Notice of Allowance for Application No. 11,398,458, dated Jun. 2, 2010, pp. 9.
IBM Technical Disclosure Bulletin, Concept for Forming Multilayer Structures for Packaging, 5 pages, Aug. 1, 1987.
IEEE 100 The Authoritative Dictionary of IEEE Standard Terms, 7th edition, 2000, IEEE Press, pp. 144, 704.
Selected Prosecution History U.S. Appl. No. 11/754,199 through May 25, 2010.
Selected Prosecution History U.S. Appl. No. 11/754,206 through May 25, 2010.
Selected Prosecution History U.S. Appl. No. 11/754,211 through May 25, 2010.
Selected Prosecution History U.S. Appl. No. 11/754,212 through May 25, 2010.
Selected Prosecution History U.S. Appl. No. 90/007,681 through May 25, 2010.
Selected Prosecution History U.S. Appl. No. 11/398,458 through May 25, 2010.

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